Modeling of Self-Assembly of Microinductors Produced Due to Residual Mechanical Stress

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Abstract

The finite element method was used to simulate four designs of three-dimensional microinductors, the production of which is carried out by self-assembly using residual mechanical stress. During the simulation the deformation of blanks made of a 300 nm thick Cr film was calculated in the specified areas of which a gradient of mechanical stress was formed. The finite element method was also used to determine the inductance of the obtained microinductors.

About the authors

A. S. Babushkin

NRC “Kurchatov institute” – Valiev IPT, Yaroslavl Branch

Author for correspondence.
Email: artem.yf-ftian@mail.ru
Yaroslavl, Russia

R. V. Selyukov

NRC “Kurchatov institute” – Valiev IPT, Yaroslavl Branch

Email: rvselyukov@mail.ru
Yaroslavl, Russia

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